2023 News

Augmented Reality Headset for Maintainers

June 12, 2023 – BANC3 has received the option contract modification to continue the work on developing a complete headset design package for a rugged, marinized, self-contained AR headset for Navy aircraft maintenance technicians. Our work began with a short feasibility study on our approach and progressed with the development of a package of design documentation such as a design specification, hardware specification, software architecture, mechanical design specification, thermal specification, battery & power specification, and security plan. We will also include a plan for two-factor authentication using CAC cards, as well as several 3D drawings of the proposed mechanical design. BANC3 will include in the design documentation a plan and approach for EMI, HERO, high/low temp operation, salt-fog, and water resistance as ruggedization requirements. BANC3 is developing a standalone, rugged augmented reality headset that can survive the wide range of harsh environments that the Navy must operate in. The same headset will be enhanced to meet all of the Navy's strict cyber security requirements as well as provide a method for two-factor authentication that does not rely on network connectivity.  

BANC3 wins a multi-year Department of Defense (DoD) contract for the Defense digital modernization effort

Princeton New Jersey, June 1, 2023 – BANC3, Inc., today announced that it has been selected under the Stimulating Transition for Advanced Microelectronics Packaging [STAMP] program to provide its software-defined receiver (SDRX) products on Intel's latest Multichip Packages. As part of the Department of Defense's (DoD's) broader digital modernization efforts, to leverage the best commercial technologies for military applications, this program will provide a new set of advanced capabilities to facilitate the accelerated transition of Intel's Multichip Packages into current DoD programs of record across the Defense Industrial Base. BANC3 will use Intel A-Tile Direct RF data converter tiles and Intel F-Tile advanced Serializer/Deserializer tiles connected to high-performance, low power Intel® Agilex™ FPGAs in the chipsets. STAMP is a program the Pentagon/DoD has introduced to facilitate the deployment of microelectronic prototypes developed through the State-of-the-art Heterogeneous Integrated Packaging Initiative (SHIP). The STAMP program seeks to advance the transition of multichip packages built through the SHIP program to military systems. The STAMP project will provide the defense industrial base opportunities to identify and integrate the Multichip Packages and perform analysis and test into programs of records. BANC3 is a leading provider of next-generation radio frequency (RF) spectrum monitoring, currently supporting National Reconnaissance Office (NRO) payload launch missions to combat the rising threat to US satellites. BANC3 is a developer and manufacturer of extremely wide instantaneous bandwidth software-defined receivers for radio frequency spectrum monitoring. "We are excited to be included in STAMP and anticipate achieving an 80% reduction in size, weight, and power by using Intel's Multichip Package while improving the performance of our SDRX solution. These enhancements will contribute to a smaller installation footprint, simplified system architecture, and better reliability for the end users," said Fred Ilsemann, Vice President of Research & Development at BANC3. "This new contract represents our company's dedication to the warfighter; developing innovative systems for critical next-generation space monitoring platforms. This builds upon our successful development and deployment of Digital RF real-time, high probability of intercept Receiver Systems to Satellite launch locations at Vandenberg, California and Cape Canaveral, Florida," said BANC3 CEO, Babu Cherukuri. "We are proud to be working with Intel and Naval Surface Warfare Center to provide the state-of-the-art products that are at the core of the critical U.S. Space Mission and prepared to support our nation's defenses in the decades to come." For more information about BANC3's SDRX technology, please visit www.banc3.com/rf-systems.  

Software enhancements for the Digital RF Receiver System Deployed to Satellite launch locations at

Vandenberg Airforce, California, and Cape Canaveral, Florida

January 2023 – BANC3 has worked on enhancing the software applications for its wide-bandwidth Digital RF Receiver System Design developed for DoD Space customers which has been deployed to customer locations. BANC3 has successfully deployed its innovative design. The production version provides extensive insight into the critical nature of the high probability of intercept and high accuracy RF signal characterization in real-time during mission-critical operations. Our digital receiver systems are implemented using high-speed analog-to-digital converters (ADCs), 100 Gb/s fiber optic interfaces, Field Programmable Gate Arrays (FPGAs), embedded processing, and client/server software applications.

USARPAC / INDOPACOM C&IN Network Engineering Support

BANC3 has been providing specialized communications and information network (C&IN) engineering support to USARPAC G6 in direct support of Theater Army and Joint Force mission command across the Indo-Pacific. Our support focuses on the engineering, integration, and operation of resilient enterprise and tactical networks, including SATCOM, terrestrial transport layers, and deployed mission command systems. BANC3 supports the design and integration of headquarters and forward-deployed network architectures, ensuring secure data transport, interoperability, and mission continuity across geographically dispersed forces operating in joint and coalition environments.

BANC3 personnel deliver on-site technical support at Fort Shafter, Hawaii, and provide reach-back and forward support to USARPAC-assigned units operating in Korea, Japan, Okinawa, Guam, and Alaska. Support activities include mission command network architecture analysis, communications systems integration, and technical planning to ensure resilient, secure, and interoperable command-and-control capabilities across geographically distributed forces.

In addition, BANC3 provides hands-on technical support for network transport optimization, SATCOM and gateway integration, tactical-to-enterprise interoperability, and operational validation of mission command systems. This includes network configuration, bandwidth management, cybersecurity and information assurance compliance, and technical troubleshooting across joint, coalition, and multinational architectures to ensure reliable mission command operations in contested and geographically complex operating environments throughout the INDOPACOM area of responsibility.