BANC3, Inc. was selected under the Stimulating Transition for Advanced Microelectronics Packaging (STAMP) program to provide its software-defined receiver (SDRX) products on Intel's latest Multichip Packages. As part of the Department of Defense's (DoD's) broader digital modernization efforts to leverage the best commercial technologies for military applications, this program will provide a new set of advanced capabilities to facilitate the accelerated transition of Intel's Multichip Packages into current DoD programs of record across the Defense Industrial Base. BANC3 will use Intel A-Tile Direct RF data converter tiles and Intel F-Tile advanced Serializer/Deserializer tiles connected to high-performance, low power Intel® Agilex™ FPGAs in the chipsets.
Program Overview:
- STAMP Initiative: A Pentagon/DoD program designed to facilitate the deployment of microelectronic prototypes developed through the State-of-the-art Heterogeneous Integrated Packaging Initiative (SHIP).
- Mission: Advance the transition of multichip packages built through SHIP to military systems.
- Industrial Base Impact: Provides defense industrial base opportunities to identify and integrate Multichip Packages and perform analysis and testing into programs of record.
BANC3's Capabilities:
- RF Spectrum Monitoring: Leading provider of next-generation radio frequency (RF) spectrum monitoring.
- Mission Support: Currently supporting National Reconnaissance Office (NRO) payload launch missions to combat the rising threat to US satellites.
- Technology: Developer and manufacturer of extremely wide instantaneous bandwidth software-defined receivers for radio frequency spectrum monitoring.
- Performance Metrics: Expected 80% reduction in size, weight, and power by using Intel's Multichip Package while improving performance of SDRX solution.
Key Benefits:
- Smaller Installation Footprint: Significant reduction in physical space requirements.
- Simplified System Architecture: Streamlined integration and deployment.
- Better Reliability: Enhanced performance and stability for end users.
- Next-Generation Space Monitoring: Contributes to critical space monitoring platforms.
Technical Specifications:
| Specification | Details |
|---|---|
| Architecture | Direct RF Software Defined Radio |
| Frequency Range | 1-18 GHz |
| Channels | 4 x TX / RX |
| Instantaneous Bandwidth per Channel | Programmable, 8 GHz (max) ... 62.5 MHz (min) |
| Receiver Type | Real Time Spectrum Analyzer |
| Signal Detection | Digital Instantaneous Frequency Measurement |
| Data Output | Maximum / Mean Spectra, Digital Descriptor Words |
| Built-in-Test (BIT) | One test signal per channel (TX port) |
| Interface | 1Gb Ethernet, SFP single mode fiber, JTAG, Console |
| Reference | 10 MHz Ref (input / output) |
| Input Power | 12 VDC |
| Dimensions | 6 x 8 x 4 in |
| Weight | 5 lbs |
Executive Leadership
"We are excited to be included in STAMP and anticipate achieving an 80% reduction in size, weight, and power by using Intel's Multichip Package while improving the performance of our SDRX solution. These enhancements will contribute to a smaller installation footprint, simplified system architecture, and better reliability for the end users."
"This new contract represents our company's dedication to the warfighter; developing innovative systems for critical next-generation space monitoring platforms. This builds upon our successful development and deployment of Digital RF real-time, high probability of intercept Receiver Systems to Satellite launch locations at Vandenberg, California and Cape Canaveral, Florida. We are proud to be working with Intel and Naval Surface Warfare Center to provide the state-of-the-art products that are at the core of the critical U.S. Space Mission and prepared to support our nation's defenses in the decades to come."